Call For Papers

Large-Area Electronics (LAE) is a new way of making electronics and includes printed, flexible, hybrid, plastic, organic and bio-electronics. LAE opens up new markets for electronics and expands existing products by adding new form factors, new functionality and enabling new cost structures. Applications abound in high growth industrial sectors such as healthcare and medical, sport and fitness, fast moving consumer goods, automotive, the Internet of Things, printing and packaging and smart wearables. The new form factors and flexibility possible with LAE allow electronic systems to be deployed in a wide variety of non-traditional situations: in and on paper, plastic, textiles, furniture, cars and buildings, as well as on packaging and even in and on the human body.

innoLAE 2026 represents a unique opportunity to hear the latest developments from academic and industrial teams active in LAE research and technology, including keynotes and invited talks from leading international organisations.

Our Twelfth annual conference, innoLAE 2026 will be on 18-19 February 2026, presenting a varied 2-day programme featuring contributions from academia and industry, highlighting the most recent and exciting innovations in LAE and new products incorporating LAE technologies. innoLAE 2026 will offer both plenary and parallel track oral presentations, a poster session with prizes awarded to the most promising scientific and technical developments, an exhibition with leading companies and organisations showcasing their latest products and developments, as well as extensive networking opportunities.

Conference topics

We invite contributions to the conference programme on topics relating to LAE such as:

1. Manufacturing LAE components and systems

  • Improved and novel processes for LAE manufacturing offering higher throughput, sustainability, functionality, reliability, yield or lower cost

  • New approaches for LAE manufacturing including soft lithography, micro-contact printing, nano imprint lithography, self assembly

  • Addressing the challenges and opportunities of non-traditional substrates e.g. paper, plastics, metal, fabrics, living tissue

  • Manufacturing using roll-to-roll deposition

  • Tackling the challenges of scale-up in LAE manufacturing, including metrology, yield, lean manufacture and design for manufacturing

  • 3D printing/in-mould printing/additive manufacture of electronics

  • Flexible hybrid electronics and novel interconnects - integrating organic or printed electronics with conventional semiconductor devices

  • Stretchable and conformable electronics

  • Structural electronics

  • Integration of LAE components

  • Advancing the reliability and lifetime of LAE components and systems

2. High-performance materials for LAE including

  • Organic semiconductors

  • Metal oxides

  • Graphene, 2D and layered materials

  • Perovskite and perovskite-inspired materials

  • Quantum dots

  • Novel conductors and dielectrics

  • Stretchable and biocompatible materials

  • Biodegradable and recyclable materials

  • Discovery and design of new materials using machine learning

3. Novel LAE devices and systems including

  • Organic light-emitting diodes (OLEDs) for display and lighting

  • Near-IR OLEDs and OPDs for medical applications

  • Transistors, diodes, sensors, detectors, etc.

  • Energy harvesting and storage using LAE (e.g. RF, piezo, thermal and solar harvesting, printable batteries, supercapacitors and wireless charging)

  • Third generation photovoltaic (PV) – organic, perovskite, quantum dot (QD) and hybrid/tandem/multi-layer devices

  • Circuit elements e.g. amplifiers, A-D converters, multiplexers, microprocessors, microcontrollers etc.

  • Circuits incorporating LAE including multi-element LAE device arrays

  • LAE circuit design and modelling, including design automation

  • Flexible displays – both emissive and reflective

  • Gas sensors

  • Neuromorphic devices and circuits

4. Bioelectronics

  • LAE devices and systems for bioelectronics

  • New applications and business models for bioelectronics

  • Neural and neuromorphic electronics

  • Biosensors

  • Drug delivery devices

  • Wearable devices

  • Cutaneous and implantable devices

  • In vitro systems and printed organs

  • Printed scaffolds for bioelectronics

5. Applications of LAE including

  • Solar

  • Displays

  • Smart textiles, E-textiles and smart garments

  • Smart packaging

  • Internet of Things (IoT)

  • Automotive

  • Aerospace

  • Smart buildings/structural health monitoring

  • Security

  • Smart agriculture, agri-food sensors

  • Design of systems using LAE components for specific applications

  • Application case studies of new LAE systems used in market trials

6. Sustainability and energy efficiency

  • Contribution of LAE towards a sustainable/circular economy and ‘net zero’

  • Use of LAE in devices/products for circular economy (batteries, solar, etc.)

  • Biomaterials and recyclable materials as substrates for LAE

  • Sustainable materials, end-of-life management, waste reduction

  • Recycling and reuse of LAE materials, components and systems and lifecycle analysis

Submissions

Abstracts for oral and poster presentations need to be submitted using link above. For further submission instructions see the guidelines document.

If you want to submit your abstract for a poster only please put “Poster” as the first keyword.

It is a condition of submission that, if accepted, the paper will be presented at the conference (as either an oral or poster presentation) by one of the authors.

  • Selection Criteria: The programme committee will select papers within conference scope to create a balanced programme based on degree of innovation, manufacturing advance and commercial opportunity.

  • Conference Rates:

    • Industry contributors whose papers are accepted for oral presentation may register for the conference at the discounted rate of £325 (a £170 discount from the standard registration rate of £495)

    • Academic contributors may register for £325

    • Student contributors may register for £225

Presentation
Your presentation slot will be 25 minutes, including time for questions, so typically 20-22 minutes for the presentation and 3-5 minutes for questions.

Key dates

Oral Presentation Deadline: 31 October 2025

Call for Papers Notification: We aim to notify contributors of the Programme Committee’s decision by 1 December 2025.

Late News Poster Deadline: Submit your late news poster abstract by 17 February 2026.

SUBMISSION Criteria

If you wish to present your work, please complete the form linked below. You will need the following:

  • Your abstract should be within the conference scope and topics listed above

  • Your abstract, which should be written in English and the main text should be no longer than 500 words.

  • A photograph of the presenter which will be used in the conference programme and on the website. The format should be .jpg, .bmp, .gif or .png, minimum 300x300 pixels.

  • A short biography of the presenter

  • Your company/institution logo which will be used in the conference programme and on the website. The format should be .bmp, .gif or .png, minimum 300x300 pixels.

  • For detailed submission instructions see these guidelines.

  • A condition of submission is that, if accepted, the paper will be presented at the conference by one of the authors.

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