Professor Mark Poliks
State University of New York, Binghamton
Title: Flexible Hybrid Electronics — “Unpackaged” Electronics for the Next Generation of Wearable Devices
Flexible Hybrid Electronics (FHE) integrates “un-packaged” devices from thinned silicon wafers with flexible and printed circuits in formats that can be thin, light-weight, flexible, bendable, conformal, potentially stretchable and disposable. FHE is ushering in an era of “electronics on everything,” leading to improved wear-ability and performance for the next generation of smart monitoring products. NextFlex is a consortium of companies, academic institutions, federal and state governments with a shared goal of advancing U.S. Manufacturing of Flexible Hybrid Electronics. This presentation describes NextFlex FHE research and development projects underway as part of the NextFlex New York Node.
Mark D. Poliks is Empire Innovation Professor of Engineering, Professor of Systems Science and Industrial Engineering, Professor of Materials Science and Engineering and Director of the Center for Advanced Microelectronics Manufacturing (CAMM) at the State University of New York at Binghamton. He serves as Chair of the Smart-Energy Transdisciplinary Area of Excellence at the Binghamton campus. In 2006 he established the first research center (CAMM), to explore the application of roll-to-roll processing methods to flexible electronics and displays, with equipment funding from the United States Display Consortium (USDC) and the Army Research Lab. His research is in the areas of industry relevant topics that include: high performance electronics packaging, flexible hybrid electronics, medical and industrial sensors, printed RF components, materials, processing, aerosol jet printing, roll-to-roll manufacturing, in-line quality control and reliability of electronics. He has received more than $20M in research funding from Federal, New York State and corporate sources and more than $30M in equipment funding from federal and state sources. He is the recipient of the SUNY Chancellor’s Award for Excellence in Research. He leads the New York State Node of the DoD NextFlex Manufacturing USA and was named a 2017 NextFlex Fellow. He received FLEXI awards for leadership in Technology and Education from the FlexTech Alliance in 2009 and 2019. He has authored over one-hundred technical papers and holds forty-eight US patents. He was the General Chair of the 69th IEEE ECTC and will serve as a IEEE Electronics Packaging Society Distinguished Lecturer from 2020-2023.